Ultra-precision and cleanroom quality - when micrometers make the difference
In the semiconductor industry, a few thousandths of a millimeter in the dimensions of a workpiece often make the difference between a good part and a reject. The requirements for precision, cleanliness and process reliability are higher than in almost any other industry. Meeting standards is not enough. Only the latest high-tech solutions make it possible to shape complex geometries and the finest structures with a repeat accuracy of a few µm in a productive, high-quality and efficient manner.
Maximum precision and perfect surfaces as a benchmark
Each component contributes to increasing the performance of modern electronics and making innovations a reality. Whether wafer chucks made of silicon carbide, high-precision frames made of quartz glass or complex housings for lithography systems - the workpieces to be produced are characterized by maximum complexity and minimal manufacturing tolerances. Even the smallest deviations can result in significant production downtime or subsequent malfunctions. In addition, there are extreme demands on cleanliness and material diversity - from technical glass and ceramics to high-alloy metals. The production environment itself must also meet the highest standards of cleanliness in order to prevent contamination and ensure that the subsequent assemblies function properly.
Complexity, diversity, time pressure and sustainability as challenges
What's more, innovation cycles in the semiconductor industry are becoming ever shorter. At the same time, new technologies, miniaturization and the trend towards sustainable production processes demand flexible, scalable and resource-saving production solutions. At the same time, it is important to ensure cost-effectiveness and reliably meet the increasing quality requirements at every stage of the process. The classic separation of individual processes is therefore considered inefficient. In contrast, integrated, digitally networked process chains that minimize sources of error, shorten set-up times and enable seamless quality control are in demand.
As requirements in the semiconductor industry continue to rise, traditional manufacturing approaches are increasingly reaching their limits. And so, a new generation of solutions is dynamically moving into the focus of value creation. Above all, the ability to seamlessly integrate complex machining, automated processes and digital networking is becoming a decisive competitive advantage.
Securing the present and shaping the future with DMG MORI
And this is precisely why the semiconductor industry is considered a promising and logical strategic growth market for DMG MORI. As a recognized solution provider for high-precision, automated and digitally networked manufacturing solutions, the leading manufacturer wants to further expand its technological leadership and gain market share. The foundation for this is laid by the Machining Transformation (MX) strategy, with which DMG MORI has heralded a paradigm shift in CNC manufacturing that goes far beyond the optimization of individual machines.
With Machining Transformation (MX), DMG MORI combines the pillars of process integration, automation, Digital Transformation (DX) and Green Transformation (GX) into a holistic approach. The aim is to increase the performance of individual systems and revolutionize the entire machining value chain. The integration of several machining steps on one machine, the use of real-time data and the automation of entire process chains create a new dimension of productivity, quality and efficiency. This is clearly demonstrated by a look at the four pillars of process integration in the semiconductor industry:
Process Integration
Thanks to the use of 5-axis technologies and process-integrated complete machining, several production steps are combined in a single clamping operation. This allows complex geometries - such as wafer chucks or precision frames - to be produced in a single machine with maximum dimensional accuracy and surface quality. Integrated measurement technology also enables direct quality control during the process and reduces the risk of rejects and reworking to a minimum.
Automation
Automation solutions such as modular workpiece and pallet handling systems or autonomous robots create the basis for cost-effective 24/7 production. They increase machine availability by thousands of hours per year, ensure consistent component quality and also relieve skilled personnel of repetitive tasks.
Digital Transformation (DX)
With the CELOS X digital platform, modern CAD/CAM integrations and comprehensive networking solutions, production becomes transparent, controllable and continuously optimizable. Real-time data from machines, tool management and measurement technology flow together and enable, among other things, seamless traceability and predictive production planning. Meanwhile, digital twins and simulations help to virtually safeguard processes and detect errors at an early stage.
Green Transformation (GX)
Energy-efficient machines, resource-conserving processes and the use of sustainable materials reduce the ecological footprint of production. Intelligent control systems optimize energy consumption, extend the service life of operating resources and minimize the use of cooling lubricants. This results in production that is not only economical, but also ecologically sustainable.
cleanONE – Clean room from the beginning
The most important distinguishing feature from the classic machining center: the cleanliness of the machine. DMG MORI developed the so-called cleanONE program for this purpose at the request of the semiconductor industry. Machines in the cleanONE range are already treated with the greatest care in terms of cleanliness during the production phase and quality assurance final acceptance at the factory. This guarantees the end customers of these systems immediate and reliable production of the highly sensitive components, which are later used in an atmosphere in accordance with cleanroom class ISO 1. This specification is representative of the permitted quantity of particles or microorganisms in the production environment. ISO class 1 stipulates that the particle load per cubic meter of air must not exceed ten particles with a size of ≥ 0.1 µm.
Technology, people and partnership: success factors for semiconductor production
The technological excellence of DMG MORI manufacturing solutions is the foundation - but only in combination with qualified specialists and strong partnerships does it unfold its full potential. The integration of automation and digitization relieves personnel of routine tasks and creates scope for value-adding tasks such as process optimization and quality assurance. At the same time, DMG MORI offers comprehensive training and support services to continuously train users and quickly make new technologies productive.
Partnership-based cooperation with customers, suppliers and technology partners is essential. Only through close dialogue can the individual requirements of the semiconductor industry be understood and tailor-made solutions developed - from prototyping and µm-precise series production through to continuous process optimization.
With Machining Transformation (MX), DMG MORI offers the semiconductor industry a future-oriented solution platform to meet the increasing demands for precision, efficiency and sustainability with confidence - and to shape the production of tomorrow today.
Precision and innovation in the application
- Complete machining in a single clamping operation ensures compliance with the tightest tolerances and reduces throughput times for frames and housings for lithography systems, among other things.
- Automated production cells with integrated measuring technology enable reproducible precision production under the highest cleanliness requirements.
- ULTRASONIC technology and adaptive spindles are used to realize high-precision micro holes and complex contours in brittle-hard materials for so-called wafer chucks made of silicon carbide - with minimum process forces and maximum surface quality.