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product-picture 1

ULTRASONIC axialGRINDING

  • Grinding of rotationally symmetrical structures in hard-brittle materials with highest performance
  • Manufacturing of bearing rings, wafer chucks, microwave windows for many areas of the semiconductor industry, optics and technical ceramics
  • Use for various contours, also spheres

Highlights

Customer Benefits

  • Easy programming through intuitive operator masks
  • Selection of different cutting edges and angle of the grinding tool
  • Automatic adjustment of the tool contact point depending on the contour
User Interface
Left : Different tool settings for changing the engagement point of the of the ULTRASONIC grinding tools. / Right : Simple setup of the grinding tools including edge radii.

Downloads

Downloads

Technical data


Machines
ULTRASONIC Series
Controls
CELOS with SIEMENS
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● available