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Themed image product-picture 1

ULTRASONIC axialGRINDING

  • Grinding of rotationally symmetrical structures and in particular 3D contours in hard-brittle materials with maximum performance
  • Production of bearing rings, wafer chucks, microwave windows for many areas of the semiconductor industry, optics and technical ceramics
  • Grinding of spheres possible

Highlights

Customer Benefits

  • Simple programming of complex 3D contours* and rotationally symmetrical geometries using intuitive operator screens
  • Selection of different cutting edges and setting angles of the grinding tool
  • Automatic adjustment of the tool contact point depending on the contour

*Only the ULTRASONIC axialGRINDING cycle can grind 3D contours. The standard grinding cycle from DMG MORI for FDS machines cannot grind 3D contours.

Themed image User Interface
Left : Different tool settings for changing the engagement point of the of the ULTRASONIC grinding tools. / Right : Simple setup of the grinding tools including edge radii.
Themed image Sealing ring, SiC
Sealing ring, SiC
Themed image Ring, quarts glass
Ring, quarts glass
Themed image Resonator, quartz glass
Resonator, quartz glass
Themed image Sealing ring, SiC
Themed image Ring, quarts glass
Themed image Resonator, quartz glass

Downloads

Technical data


Machines
ULTRASONIC Series
Controls
CELOS with SIEMENS
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● available